近日，美国政府以台积电（TSMC）涉嫌违反此前达成的投资协议条款为由，要求其进一步加大对美投资力度。据媒体报道，美方认为台积电在亚利桑那州的晶圆厂建设进度滞后、技术转移未达预期，且先进制程产能部署不及承诺水平，因此敦促其追加投资并加快落地先进芯片制造能力。台积电自2020年起响应美国‘芯片法案’号召，在亚利桑那州投资兴建两座晶圆厂，原计划分别于2024年和2026年投产4纳米与3纳米制程。然而，由于供应链、人力短缺及文化差异等因素，项目多次延期。美方担忧这将影响其本土半导体供应链安全，尤其是在中美科技竞争加剧的背景下。分析指出，美方此举不仅意在确保关键技术回流，也试图通过施压强化对全球半导体产业链的掌控。台积电方面则强调仍致力于美国投资，并正积极解决运营挑战。未来双方如何协调承诺与现实之间的落差，将成为影响全球芯片产业格局的关键变量。
Recently, the U.S. government has accused Taiwan Semiconductor Manufacturing Company (TSMC) of violating terms in its prior investment agreement and is urging the company to significantly increase its investments in the United States. According to media reports, U.S. officials claim that TSMC’s Arizona fab construction has fallen behind schedule, technology transfers have not met expectations, and deployment of advanced process nodes has lagged behind initial commitments.Since 2020, TSMC has responded to the U.S. CHIPS Act by investing in two semiconductor fabrication plants in Arizona, originally slated to begin production of 4-nanometer and 3-nanometer chips in 2024 and 2026, respectively. However, the projects have faced repeated delays due to supply chain constraints, labor shortages, and cultural differences in workplace practices. Washington is increasingly concerned that these setbacks could undermine domestic semiconductor supply chain security, especially amid intensifying U.S.-China tech rivalry.Analysts note that the U.S. move aims not only to secure the onshoring of critical technologies but also to strengthen its control over the global semiconductor supply chain through strategic pressure. TSMC maintains its commitment to U.S. investments and is actively addressing operational challenges. How both sides reconcile promised timelines with on-the-ground realities will be a pivotal factor shaping the future of the global chip industry.
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