近日，上海泰矽微电子有限公司（简称“泰矽微”）宣布完成新一轮近亿元人民币的融资。本轮融资由知名投资机构领投，多家老股东持续跟投，资金将主要用于高性能模拟芯片及专用SoC产品的研发、人才引进以及市场拓展。泰矽微成立于2019年，专注于车规级和工业级高性能模拟与混合信号芯片的设计与开发，已成功推出多款应用于汽车电子、电源管理、信号链等领域的芯片产品，并获得多家头部车企及Tier 1供应商的认证与订单。在当前国产替代加速、汽车电子需求激增的背景下，泰矽微凭借其深厚的技术积累和快速的产品迭代能力，正迅速成长为国内模拟芯片领域的重要力量。本轮融资本将进一步夯实其技术壁垒，加快产品落地节奏，助力公司在全球半导体产业链中占据更有利的位置。
Recently, Shanghai Tismicro Electronics Co., Ltd. (“Tismicro”) announced the completion of a new round of financing amounting to nearly RMB 100 million. This round was led by prominent investment institutions, with continued participation from several existing shareholders. The proceeds will be primarily used for the R&D of high-performance analog ICs and application-specific SoCs, talent acquisition, and market expansion. Founded in 2019, Tismicro specializes in designing and developing automotive- and industrial-grade high-performance analog and mixed-signal chips. The company has successfully launched multiple chip products targeting automotive electronics, power management, and signal chain applications, securing certifications and orders from leading automakers and Tier 1 suppliers. Against the backdrop of accelerated domestic substitution and surging demand in automotive electronics, Tismicro is rapidly emerging as a key player in China’s analog semiconductor sector, thanks to its strong technical expertise and agile product development cycle. This funding round will further strengthen its technological moat, accelerate product commercialization, and enhance its position in the global semiconductor supply chain.
原创文章，作者：admin，如若转载，请注明出处：https://ktez.cn/7571.html