近日，据行业消息人士透露，三星电子已与英伟达（NVIDIA）正式敲定2024年高带宽内存HBM4的供应协议。这一合作标志着三星在高端AI芯片存储市场的重要突破，也凸显了英伟达对高性能计算硬件持续增长的需求。HBM4（High Bandwidth Memory 4）是当前最先进的高带宽内存技术之一，相较于前代HBM3，其在数据传输速率、能效比和堆叠容量方面均有显著提升。随着生成式AI和大模型训练对算力需求激增，HBM已成为AI加速器不可或缺的关键组件。英伟达计划在其下一代GPU（如Blackwell架构后续产品）中采用HBM4，以进一步提升AI训练与推理性能。三星作为全球主要的存储芯片制造商之一，近年来积极布局HBM技术，并在HBM3E阶段已获得部分客户订单。此次与英伟达达成HBM4供应协议，不仅巩固了其在高端存储市场的地位，也为未来在AI硬件生态中的深度参与打下基础。值得注意的是，SK海力士和美光等竞争对手也在加速推进HBM4量产，市场竞争日趋激烈。总体来看，三星与英伟达的合作反映了AI基础设施对先进存储技术的高度依赖，也预示着2024年HBM4将进入规模化商用阶段，推动整个AI芯片产业链的升级。
According to industry sources, Samsung Electronics has officially secured a supply agreement with NVIDIA for High Bandwidth Memory 4 (HBM4) in 2024. This partnership marks a significant breakthrough for Samsung in the high-end AI memory market and underscores NVIDIA’s growing demand for high-performance computing hardware.HBM4 is among the most advanced high-bandwidth memory technologies available today, offering notable improvements over HBM3 in data transfer rates, energy efficiency, and stack capacity. As generative AI and large language model training drive surging demand for computational power, HBM has become an essential component in AI accelerators. NVIDIA plans to integrate HBM4 into its next-generation GPUs—such as successors to the Blackwell architecture—to further enhance AI training and inference performance.As a leading global memory chip manufacturer, Samsung has been aggressively investing in HBM technology and has already secured customer orders for HBM3E. The new HBM4 deal with NVIDIA not only strengthens Samsung’s position in the premium memory segment but also positions it for deeper integration into the AI hardware ecosystem. Notably, competitors like SK Hynix and Micron are also accelerating their HBM4 production timelines, intensifying market competition.Overall, the Samsung-NVIDIA collaboration highlights the critical role of advanced memory solutions in AI infrastructure and signals that HBM4 is poised for mass adoption in 2024, driving upgrades across the entire AI chip supply chain.
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