近日，国内半导体设备龙头企业华海清科宣布其自主研发的化学机械抛光（CMP）一体机累计出机量突破20台，标志着该设备在国产替代进程中迈出关键一步。CMP工艺是芯片制造中不可或缺的关键步骤，用于实现晶圆表面的全局平坦化，直接影响芯片的良率与性能。长期以来，该领域被美国、日本等国外厂商垄断，设备采购成本高、交付周期长，制约了我国先进制程的发展。华海清科作为国内CMP设备领域的先行者，其抛光一体机集成了清洗、抛光、终点检测等多项功能，具备高精度、高稳定性及良好的工艺兼容性，已成功进入多家国内主流晶圆厂的产线验证并实现批量交付。此次出机量突破20台，不仅体现了客户对其技术实力和产品可靠性的高度认可，也彰显了国产半导体设备加速落地的能力。未来，随着国内晶圆产能持续扩张及供应链自主可控需求提升，华海清科有望进一步扩大市场份额，助力中国半导体产业链安全与升级。
Recently, Hua Hai Qing Ke (HHQK), a leading Chinese semiconductor equipment manufacturer, announced that the cumulative shipments of its self-developed Chemical Mechanical Polishing (CMP) integrated system have exceeded 20 units—a significant milestone in the domestic substitution of critical chipmaking tools. CMP is an essential process in semiconductor manufacturing, enabling global planarization of wafer surfaces and directly impacting chip yield and performance. For years, this segment has been dominated by U.S. and Japanese suppliers, resulting in high costs and long lead times that have hindered China’s advancement in advanced nodes.As a pioneer in China’s CMP equipment sector, HHQK’s integrated polisher combines polishing, cleaning, and endpoint detection capabilities into a single platform, offering high precision, stability, and broad process compatibility. The system has already passed validation at multiple leading domestic foundries and entered volume delivery. Surpassing 20 units shipped not only reflects strong customer confidence in HHQK’s technology and reliability but also highlights the accelerating adoption of homegrown semiconductor equipment. With continued expansion of domestic wafer capacity and growing demand for supply chain autonomy, HHQK is well-positioned to capture greater market share and support the resilience and upgrading of China’s semiconductor ecosystem.
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