近日，西安电子科技大学（西电）科研团队在芯片散热领域取得重大突破，成功攻克了一项长期困扰全球半导体行业的“世界难题”。随着芯片性能不断提升，功耗和发热量急剧上升，传统散热技术已难以满足先进制程芯片的热管理需求。西电团队创新性地提出一种基于微纳结构与相变材料耦合的高效散热方案，通过在芯片内部构建三维微通道网络，并结合高导热相变材料，显著提升了热量传导与扩散效率。实验表明，该技术可将芯片热点温度降低30%以上，同时延长器件寿命、提升系统稳定性。这一成果不仅为高性能计算、人工智能芯片和5G通信设备等高热流密度应用场景提供了关键支撑，也标志着我国在先进热管理技术领域迈入国际领先行列。相关研究已发表于国际顶级期刊，并获得多项国家发明专利，具备广阔的产业化前景。
Recently, a research team from Xidian University has achieved a major breakthrough in chip thermal management, successfully solving a long-standing global challenge in the semiconductor industry. As chip performance continues to advance, power consumption and heat generation have surged, outpacing the capabilities of conventional cooling technologies. The Xidian team innovatively developed a highly efficient cooling solution that integrates micro-nano structures with phase-change materials. By constructing a three-dimensional microchannel network within the chip and combining it with high-thermal-conductivity phase-change materials, the team significantly enhanced heat conduction and dissipation. Experimental results show that this technology reduces hotspot temperatures by over 30%, while also extending device lifespan and improving system stability. This advancement provides critical support for high heat-flux applications such as high-performance computing, AI chips, and 5G communication devices, marking China’s entry into the global forefront of advanced thermal management technologies. The research has been published in top-tier international journals and secured multiple national invention patents, demonstrating strong potential for industrial application.
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