近期，全球存储封测厂掀起新一轮涨价潮，部分厂商报价涨幅高达30%。这一现象主要受到多重因素推动：首先，AI、高性能计算（HPC）及数据中心等新兴应用对高带宽存储器（如HBM）需求激增，带动先进封装测试订单大幅增长；其次，先进制程所需的CoWoS、2.5D/3D封装等技术门槛高、产能有限，导致供不应求；此外，原材料成本上涨、人力与设备投入增加也推高了整体运营成本。台积电、日月光、矽品等头部封测企业已陆续调涨价格，尤其针对HBM、DDR5等高端产品线。业内人士指出，此轮涨价并非短期波动，而是结构性供需失衡的体现。随着AI芯片持续放量，未来12–18个月内封测产能仍将紧张，价格或维持高位甚至进一步上扬。对于下游客户而言，成本压力将逐步传导至终端产品，可能影响服务器、智能手机及PC等设备的定价策略。不过，长期来看，涨价也有助于激励厂商扩大先进封装投资，加速产业技术升级。
Recently, memory packaging and testing foundries worldwide have initiated a new wave of price hikes, with some vendors raising quotes by as much as 30%. This trend is driven by multiple factors: first, surging demand for high-bandwidth memory (HBM) from emerging applications such as AI, high-performance computing (HPC), and data centers has significantly increased orders for advanced packaging and testing services. Second, advanced packaging technologies like CoWoS and 2.5D/3D integration—essential for cutting-edge chips—are highly complex and capacity-constrained, leading to supply shortages. Additionally, rising costs of raw materials, labor, and equipment investments have further elevated operational expenses.Leading OSATs (Outsourced Semiconductor Assembly and Test providers), including TSMC, ASE Group, and SPIL, have already begun adjusting prices upward, particularly for premium product lines such as HBM and DDR5. Industry insiders note that this pricing surge reflects a structural supply-demand imbalance rather than a short-term fluctuation. With AI chip production continuing to scale, packaging and testing capacity is expected to remain tight over the next 12–18 months, potentially sustaining or even further increasing prices.Downstream customers will likely face mounting cost pressures, which may eventually be passed on to end products like servers, smartphones, and PCs. However, in the long run, these price increases could incentivize greater investment in advanced packaging capabilities, accelerating technological advancement across the semiconductor industry.
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