近日，新声半导体宣布完成C轮融资，世运电路等多家知名投资方参与本轮投资。本轮融资将主要用于加速公司在射频前端芯片及模组领域的技术研发、产能扩张以及市场拓展。新声半导体成立于2018年，专注于5G通信、物联网和智能终端所需的高性能射频前端解决方案，已成功推出多款具有自主知识产权的滤波器、功率放大器和射频开关产品。作为国内领先的PCB制造商，世运电路此次战略入股，不仅体现了其对半导体产业链上游布局的重视，也标志着电子制造与芯片设计企业之间协同发展的新趋势。业内分析认为，随着5G和AIoT设备需求持续增长，射频前端市场将迎来新一轮爆发，新声半导体凭借技术积累与资本加持，有望在国产替代进程中占据关键地位。此次融资将进一步巩固其在高端射频芯片领域的竞争力，并推动中国半导体供应链的自主可控进程。
Recently, Xinsheng Semiconductor announced the completion of its Series C financing round, with Shiyun Circuit and several other prominent investors participating. The proceeds will primarily be used to accelerate R&D, expand production capacity, and broaden market reach in the field of RF front-end chips and modules. Founded in 2018, Xinsheng Semiconductor specializes in high-performance RF front-end solutions for 5G communications, IoT, and smart devices, having successfully launched a range of proprietary products including filters, power amplifiers, and RF switches. As a leading domestic PCB manufacturer, Shiyun Circuit’s strategic investment underscores its commitment to upstream integration within the semiconductor supply chain and signals a growing trend of collaboration between electronics manufacturing and chip design firms. Industry analysts note that with rising demand for 5G and AIoT devices, the RF front-end market is poised for significant growth. Bolstered by technological expertise and fresh capital, Xinsheng Semiconductor is well-positioned to play a pivotal role in China’s ongoing semiconductor localization efforts. This funding round is expected to further strengthen its competitiveness in high-end RF chips and advance the self-reliance of China’s semiconductor supply chain.
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