近日，工业和信息化部等八部门联合印发《关于推动智能芯片软硬协同发展的指导意见》，旨在加快我国智能芯片产业高质量发展，提升关键核心技术自主可控能力。《意见》强调，要统筹推进硬件设计与软件生态的协同发展，突破高端芯片制造、先进封装、基础软件工具链等关键环节，构建从芯片设计、制造到应用的完整产业链。同时，鼓励企业、高校和科研机构加强合作，推动人工智能、大模型等新兴技术与智能芯片深度融合，打造具有国际竞争力的智能芯片产业集群。此外，《意见》还提出优化产业政策环境，加大财政金融支持，完善人才培养机制，为智能芯片产业发展提供全方位保障。这一举措将有力支撑我国在人工智能、自动驾驶、智能终端等前沿领域的创新应用，夯实数字经济发展底座。
Recently, eight Chinese government departments, including the Ministry of Industry and Information Technology (MIIT), jointly issued the ‘Guiding Opinions on Promoting the Coordinated Development of Hardware and Software for Intelligent Chips,’ aiming to accelerate high-quality development of China’s intelligent chip industry and enhance self-reliance in core technologies. The document emphasizes coordinated advancement of hardware design and software ecosystems, calling for breakthroughs in key areas such as high-end chip manufacturing, advanced packaging, and foundational software toolchains to build a complete industrial chain—from chip design and fabrication to end-use applications. It also encourages deeper collaboration among enterprises, universities, and research institutes to integrate emerging technologies like artificial intelligence and large models with intelligent chips, fostering internationally competitive industrial clusters. Additionally, the guidelines propose optimizing the policy environment, increasing fiscal and financial support, and improving talent development mechanisms to provide comprehensive backing for the sector. This initiative is expected to significantly bolster innovation in frontier fields such as AI, autonomous driving, and smart devices, laying a solid foundation for China’s digital economy.
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